Wet Film Solder Mask Setup Options

The Apply Solder Mask > Wet Film Solder Mask node of the Process Options Editor provides the following setup options:

Cleaning and Brushing Time per Panel

By default, the time to remove any dust or tarnish from the panel before applying the solder mask is specified by the cost model variable wetFilmSolderMaskCleanTime (60 seconds in starting point Digital Factories).

With the setup option Cleaning and Brushing Time per Panel (defined by the Apply Solder Mask > Wet Film Solder Mask node of the Process Options Editor), users can override the default on a per-part basis.

Handling and Printing Time per Panel

By default, the handling and printing time per panel for the Wet Film Solder Mask process depends on the following:

  • Machine property Print Rate

  • Machine property Panel Orientation

The handling and printing time is the reciprocal of Print Rate, if the panel can be processed in a single machine cycle, that is, if either of the following holds:

  • Panel Orientation is Vertical.

  • Current part has a single copper layer.

Otherwise, the handling and printing time is twice the reciprocal of Print Rate (because the panel must be processed in two cycles, one for each side of the panel).

With the setup option Handling and Printing Time per Panel (defined by the Apply Solder Mask > Wet Film Solder Mask node of the Process Options Editor), users can override the default on a per part basis.